2OU3N3G-GNR
2OU chassis with three-bay shelf for ORv3, up to 3200W per sled from 50/48V busbar. Each sled supports a single Intel Xeon E2 Socket processor, 8 DIMM slots, 4 hot-swap 2.5" NVMe drive bays, and multiple PCIe5.0 x16 slots.
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Key specifications
- 2OU chassis with three-bay shelf for ORv3
- Up to 3200W per sled from 50/48V busbar
- Single Socket E2 (LGA 4710) per sled
- Supports Intel® Xeon® 6700P-series, 6500P-series, and 6700E-series processors
- 8 DIMM slots (1DPC) per sled
- Supports DDR5 RDIMM, MRDIMM
- 4 Hot-swap 2.5" NVMe (PCIe5.0 x4) drive bays per sled
- 1 FHFL dual-slot PCIe5.0 x16 per sled, supports add-in cards up to 600W TPD at 25°C ambient
- 1 HHHL single-slot PCIe5.0 x16 per sled
- Supports 2 M.2 (PCIe5.0 x4) per sled
- 1 OCP NIC 3.0 (PCIe5.0 x16) per sled
- Remote management (IPMI) per sled
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